Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper materials to create top-side interconnects, which can substitute wire bonds in power packages. Here, was exploited fully printed interconnect and, additionally, clip-attach. The electrical thermal performances copper-sinter interconnections (“sinterconnects”) were compared system with bonds. results indicate comparable characteristics sinterconnect structures wire-bonded ones. Moreover, performance sinterconnects module further quantified at higher load currents via finite element analysis. It identified that full-area contact facilitated by planar reduce ohmic losses enhance management